PROBE PIN FOR SEMICONDUCTOR DEVICE TEST

摘要

PROBLEM TO BE SOLVED: To solve a problem in which a conventionally shaped probe pin tip causes a projection part to be worn and rounded by repeated contacts with terminals of a semiconductor device, resulting in that an oxide film of the terminal of the semiconductor device cannot be broken sufficiently to increase contact resistance, and an electrical test of the semiconductor device provides failure determination, resulting in inaccurate determination.SOLUTION: A probe pin has a cylindrical main body, and has a shape in which a main body tip includes four high projections and four low projection that are alternately arranged. Thus, even when the high projections are worn, the low projections maintain contact. Consequently, an electrical test of the semiconductor device can be performed accurately.