SURFACE TREATMENT PLATED MATERIAL AND PRODUCTION METHOD OF THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a surface treatment plated material in which generation of whisker is suppressed, favorable solderability and low contact resistance are maintained even when being exposed to a high temperature environment, and insertion force of terminal and connector is low.SOLUTION: A surface treatment plated material is a plated material in which a Ni or Ni alloy plating layer, a Ag or Ag alloy plating layer, and a Sn or Sn alloy plating layer are sequentially formed to a metal base, wherein an amount of a Si element that adheres to a surface of the Sn or Sn alloy plating is Si:1×10-6×10mol/cm.