发明名称 COMPONENT SUPPLY DEVICE AND COMPONENT SUPPLY METHOD
摘要 PROBLEM TO BE SOLVED: To provide a component supply device for peeling off a top tape from a carrier tape capable of preventing interference of a transfer head of a component mounting apparatus with a nozzle.SOLUTION: A component supply device 10 includes: an inclined path P2; a horizontal path P3 extending from the front end of the inclined path P2 through a component supply position Q; a sprocket 12 that engages with feeding holes 202b of a carrier tape 200 above the inclined path P2; a guide member 14 that performs a positioning of the carrier tape 200 on the horizontal path P3 in a width direction; and a top tape peeling mechanism 50 disposed in an inclined area 24 above the inclined path P2 for peeling off a top tape 204 from a base tape 202 on the inclined path P2 between the sprocket 12 and the horizontal path P3. The top tape peeling mechanism 50 has: a blade 52 for peeling off the top tape; and a guide member 54 for guiding the top tape 204 peeled off by the blade 52 in a direction away from the component supply position Q while preventing the top tape 204 from being lifted up.
申请公布号 JP2014086502(A) 申请公布日期 2014.05.12
申请号 JP20120232998 申请日期 2012.10.22
申请人 PANASONIC CORP 发明人 KITANI MINORU;MATSUKAWA SHIGERU;KIDO KAZUO;SANO TATSUYA
分类号 H05K13/02 主分类号 H05K13/02
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