发明名称 |
COMPONENT SUPPLY DEVICE AND COMPONENT SUPPLY METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a component supply device for peeling off a top tape from a carrier tape capable of preventing interference of a transfer head of a component mounting apparatus with a nozzle.SOLUTION: A component supply device 10 includes: an inclined path P2; a horizontal path P3 extending from the front end of the inclined path P2 through a component supply position Q; a sprocket 12 that engages with feeding holes 202b of a carrier tape 200 above the inclined path P2; a guide member 14 that performs a positioning of the carrier tape 200 on the horizontal path P3 in a width direction; and a top tape peeling mechanism 50 disposed in an inclined area 24 above the inclined path P2 for peeling off a top tape 204 from a base tape 202 on the inclined path P2 between the sprocket 12 and the horizontal path P3. The top tape peeling mechanism 50 has: a blade 52 for peeling off the top tape; and a guide member 54 for guiding the top tape 204 peeled off by the blade 52 in a direction away from the component supply position Q while preventing the top tape 204 from being lifted up. |
申请公布号 |
JP2014086502(A) |
申请公布日期 |
2014.05.12 |
申请号 |
JP20120232998 |
申请日期 |
2012.10.22 |
申请人 |
PANASONIC CORP |
发明人 |
KITANI MINORU;MATSUKAWA SHIGERU;KIDO KAZUO;SANO TATSUYA |
分类号 |
H05K13/02 |
主分类号 |
H05K13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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