发明名称 SEAL BOARD, SEALING METHOD, SEAL DEVICE, AND CONTAINER
摘要 PROBLEM TO BE SOLVED: To provide a seal board, a sealing method, a seal device, and a container, which can form a resin sump by a heat seal even in a thin member of the container so as to obtain high sealability.SOLUTION: A seal part 1A of an annular seal board 1 is provided with a curved surface part 12, the inner peripheral edge of which is curved, and an inclined surface part 11 provided to be connected to the curved surface part 12 and inclined to a surface to be heat sealed on the outer peripheral edge side. The radius of curvature of the curved surface part 12 is set larger than 0.5H. Even when a thin container body and a lid member are heat sealed, a resin pool can be formed in the vicinity of the inner peripheral edge of the heat seal part corresponding to the inner peripheral edge of the seal part 1A so that a heat seal having high sealability and easily opening performance can be obtained.
申请公布号 JP2014084159(A) 申请公布日期 2014.05.12
申请号 JP20120235792 申请日期 2012.10.25
申请人 IDEMITSU UNITECH CO LTD 发明人 TAKEMOTO HITOKO
分类号 B65B7/28;B65B51/10;B65D77/20 主分类号 B65B7/28
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