RESIN SUBSTRATE, METAL-CLAD LAMINATE, PRINTED CIRCUIT BASAL PLATE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin substrate in which warpage that generates in a heating process such as a reflow process is suppressed.SOLUTION: A resin substrate 100 is produced by impregnating a resin material in a fiber substrate 101, which is a woven cloth substrate. The resin substrate 100 satisfies α2>α1, where α1 is a linear expansion coefficient of the resin substrate 100 in a direction in the surface of the substrate in the temperature range between 50°C and 150°C, and α2 is a linear expansion coefficient of the fiber substrate 101 in the temperature range between 50°C and 150°C, when first measurement (first Run) in which temperature of the resin substrate 100 is raised from 30°C to 260°C is performed using a thermomechanical analysis apparatus.