发明名称 SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element having a crack in a semiconductor layer restrained.SOLUTION: The semiconductor light-emitting element is provided with a laminate semiconductor layer including a luminous layer which emits light upon current conduction. The laminate semiconductor layer has a lower side semiconductor bottom face 214, a semiconductor side face rising from the periphery of the lower side semiconductor bottom face 214 upward and outward of the laminate semiconductor layer, and a lower side semiconductor top face 213 extending from the upward periphery of the semiconductor side face toward the inside of the laminate semiconductor layer, thereby facing upward. The periphery of the lower side semiconductor top face 213 has a first straight line part 231 and a second straight line part 232 extending in linear form and a plurality of connection parts 233 for connecting the first straight line part 231 and the second straight line part 232. When viewed from a direction perpendicular to the lower side semiconductor top face 213, each of the connection parts 233 is located inward of the point of intersection of extensions of the first straight line part 231 and the second straight line part 232 connected to the connection parts 233.</p>
申请公布号 JP2014086555(A) 申请公布日期 2014.05.12
申请号 JP20120234187 申请日期 2012.10.23
申请人 TOYODA GOSEI CO LTD 发明人 WANG HONGLIN ; YOKOYAMA EISUKE
分类号 H01L33/20;H01L21/306;H01L21/3065;H01L33/32 主分类号 H01L33/20
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