MANUFACTURING METHOD OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor wafer and a semiconductor device which allow a user to easily identify semiconductor chips.SOLUTION: A pattern is transferred to each of a plurality of shot areas 12 in a semiconductor wafer 10. A plurality of chip areas 14a, 14b are formed in each of the shot areas. A plurality of first dummy patterns 76c, repeatedly arranged in a first embodiment, are formed in the first chip area 14a out of the chip areas in each of the shot areas. A plurality of second dummy patterns 76d, repeatedly arranged in a second embodiment that is different from the first embodiment, are formed in the second chip area 14b out of the chip areas in each of the shot areas.