发明名称 PACKAGE FOR STORING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which improves the joining strength in a border between a wiring board and a lid.SOLUTION: A package 1 for storing an electronic component includes: a wiring board 10; a lid 12 provided on the wiring board 10; and a reinforcement member 13 provided so as to range from a side surface of the wiring board 10 to a side surface of the lid 12. The lid 12 is provided so as to seal an electronic component 2 provided on the wiring board 10. The reinforcement member 13 contains glass as a main component and further contains a material contained in the wiring board 10 and Si contained in the lid 12.
申请公布号 JP2014086588(A) 申请公布日期 2014.05.12
申请号 JP20120234872 申请日期 2012.10.24
申请人 KYOCERA CORP 发明人 SHINNO NORITAKA;KITAGAWA AKIHIKO
分类号 H01L23/02 主分类号 H01L23/02
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