| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method capable of more inexpensively manufacturing a device compared to processing which uses a protective film material such as water-soluble resin.SOLUTION: A laser processing method for performing laser processing for a wafer in which a device is formed in each of the regions partitioned by a plurality of processing schedule lines which cross each other on the surface comprises the steps of: holding a rear surface side of the wafer by holding means (holding step); forming an ice layer covering a surface of the wafer before or after performing the holding step (ice layer forming step); and forming a laser processing groove along the processing schedule lines by irradiating the wafer held by the holding means and covered by the ice layer with a laser beam of a wavelength having absorbability via the ice layer from the surface of the wafer (laser processing step). |
