| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a viscous material supply device which improves the workability of cleaning in a supply passage during maintenance thereby inhibiting a viscous material from remaining in the supply passage.SOLUTION: A solder supply part 4 (a viscous material supply device) includes: a nozzle 43 for discharging solder stored in a solder container 110 for storing the solder; and a supply mechanism 44 which transports the solder from the solder container 110 to the nozzle 43 and discharges the solder from the nozzle 43. The nozzle 43 has a bending supply passage 50 for guiding the solder from the solder container 110 to a tip of the nozzle 43 and is formed so as to be divided along the bending supply passage 50.</p> |
