| 发明名称 |
FIXING APPARATUS FOR CHIP AND METHOD FOR CUTTING CHIP PACKAGE USING THE SAME |
| 摘要 |
Disclosed is a chip fixing apparatus for preventing the deviation of a chip divided by a chip package process. The chip fixing apparatus includes a cover part which has a cover which covers the upper part of the chip package and at least one column member which protrudes from the cover to the lower part and touches the chip package; and a pusher which applies a push pressure to the cover. |
| 申请公布号 |
KR20140056420(A) |
申请公布日期 |
2014.05.12 |
| 申请号 |
KR20120118857 |
申请日期 |
2012.10.25 |
| 申请人 |
QMC. INC. |
发明人 |
KIM, JEONG SIK;SONG, SEONG HO;OH, HYO YOUNG;JUNG, YOO SEOK;RYU, BENG SO;JANG, HYEON SAM;LEE, HYOUNG KWON |
| 分类号 |
H01L21/78;H01L21/02;H01L21/301;H01L33/00 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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