| 摘要 |
The present invention relates to a laser processing device which includes a scanner composed of a galvanometer and performs a laser beam machining on a plate and the like; and a control of the laser beam machining which moves the scanner to a target position for the laser beam machining, waits during laser emitting time, and emits laser beams. The present invention enables the calculation of the jump motion time of the scanner required for the movement to the next target position after performing the laser beam machining by emitting laser beams at the synchronization timing of pulses during the laser emitting time; and immediately performs the laser beam machining without the synchronization for emitting laser beams by re-controlling a generation period of the pulses for oscillation of laser beams to be synchronized in the next laser emitting time, thereby performing the laser beam machining quicker. [Reference numerals] (a) Galvo Motion schedule; (AA) Restarting pulses by calculating time required for a jump motion beforehand; (b) Continuous-oscillated LASER Pulse; (c) Final usage pulse |
