发明名称 |
PASTE FOR FORMING AN ELECTROCONDUCTIVE FILM, ELECTROCONDUCTIVE FILM, METHOD FOR MANUFACTURING AN ELECTROCONDUCTIVE FILM, AND ARTICLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a paste for forming an electroconductive film capable of reducing the volume resistivity of the electroconductive film, an electroconductive film having an improved electroconductivity, a method for manufacturing the electroconductive film, and an article possessing the electroconductive film.SOLUTION: The paste used is a paste including 15-40 parts.mass of a resin binder with respect to 100 parts.mass of a copper powder wherein, on an occasion where the paste is heated and cured at 100 to 300°C, the density of the copper powder and the shrinkage rate of paste components excluding the solvent volume content are respectively 4.0-6.5 g/cmand 10-30 vol.%. |
申请公布号 |
JP2014086243(A) |
申请公布日期 |
2014.05.12 |
申请号 |
JP20120233769 |
申请日期 |
2012.10.23 |
申请人 |
AGC SEIMI CHEMICAL CO LTD |
发明人 |
KATO TOKUMITSU |
分类号 |
H01B1/22;C09D5/24;C09D7/12;C09D201/00;H01B1/00;H01B5/14;H01B13/00;H05K1/09 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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