| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of mounting an electronic component with a lead wire onto a circuit board, in which a degree of freedom in a soldering position of a light-emitting device with a lead wire on a circuit board is increased to facilitate designing.SOLUTION: A structure of mounting an electronic component with a lead wire onto a circuit board includes: a light-emitting device 170 with a lead wire, which is formed by drawing a lead wire 173 from a light-emitting device body 171; and a circuit board 150 formed by providing a land part 155 and a lead wire positioning hole 157. The lead wire 173 is placed substantially in parallel with a surface of the circuit board 150, and a tip end of the lead wire 173 is bent to the side of the circuit board 150 and inserted into the lead wire positioning hole 157, thereby positioning (temporarily fixing) of an electronic component 170 with the lead wire on the circuit board 150 is performed. A portion in the middle of the lead wire 173 is soldered to the land part 155. Thus, a degree of freedom in the soldering position of the light-emitting element 170 with the lead wire on the circuit board 150 is increased. Further, since the electronic component 170 with the lead wire is temporarily fixed, soldering is accurately and easily performed. |
