| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive paste yielding a metal wiring layer having a favorable plating deposition friendliness and a circuit board wherein a ceramic sintered compact possesses a metal wiring layer consisting of this electroconductive paste as well as an electronic device obtained by loading electronic components on this circuit board.SOLUTION: The provided electroconductive paste includes a metal powder, an alumina powder, a glass powder, and an organic vehicle, whereas the average particle diameter of the alumina powder is smaller than the average particle diameter of the glass powder. A circuit board 10 wherein a ceramic sintered compact 11 possesses a metal wiring layer 12 consisting of this electroconductive paste and wherein the metal wiring layer 12 is at least partially covered with a plating layer 13 is also provided. An electronic device 20 wherein electronic components 21 are loaded on this circuit board 10 is also provided. |
