发明名称 TAB LEAD, METHOD FOR MANUFACTURING TAB LEAD, AND ELECTROCHEMICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a tab lead or the like, capable of securing more firm sealing performance at a draw-out part of a tab lead of an electrochemical device.SOLUTION: A tab lead for an electrochemical device includes a lead conductor made of metal and a seal material made of an insulating resin. The tab lead has an arithmetic average roughness Ra at least at a part in contact with the seal material on the surface of the lead conductor of 0.1 μm or more and 0.3 μm or less. The lead conductor is preferably obtained by the electrodeposition of aluminum on the surface of a metal base material in an electrolyte containing a molten salt.
申请公布号 JP2014086139(A) 申请公布日期 2014.05.12
申请号 JP20120231487 申请日期 2012.10.19
申请人 SUMITOMO ELECTRIC IND LTD 发明人 OKUNO KAZUKI;HOSOE AKIHISA;GOTO KENGO
分类号 H01M2/30;C25D3/66;C25D7/00;H01G11/00 主分类号 H01M2/30
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