| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor mounting substrate including a plating layer having sufficient rigidity and equipped with a terminal part which is kept from falling off.SOLUTION: A manufacturing method of a semiconductor element mounting substrate comprises: sequentially forming plating layer including an NiP alloy plating layer, an Ni plating layer and a plurality of layers including a noble metal plating layer in a predetermined region on one surface of a metal plate from the metal plate side; forming a bonding wire of a semiconductor element and a part of a terminal part for wire bonding by half etching of a region from the one surface side, other than the region where the plating layers are formed so as to project in a vertical direction with respect to the metal plate; and projecting the plating layers from the terminal part toward the metal plate in a horizontal direction by side etching of the part of the terminal part. |
