半导体承载装置之弹性限位结构,申请号TW102219134-传众专利搜索

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发明名称	半导体承载装置之弹性限位结构
摘要
申请公布号	TWM478237	申请公布日期	2014.05.11
申请号	TW102219134	申请日期	2013.10.15
申请人	晨州塑胶工业股份有限公司台中市大雅区前村东路45巷8号	发明人	罗郁南
分类号	H01L21/67	主分类号	H01L21/67
代理机构		代理人	陈天赐台中市南屯区南屯路2段290号15楼之1
主权项
地址	台中市大雅区前村东路45巷8号

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