PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed circuit board according to one embodiment of the present invention includes a base substrate including an interlayer circuit, an insulation layer which is formed on the base substrate, a via which is formed on the insulation layer and is electrically connected to the interlayer circuit, and a conductive pattern which is formed on the via and has a smaller width than the upper width of the via. At this time, the via and the conductive pattern are an integrated single plating layer.