| 摘要 |
A convective circulation-type cooling device (1) for an electronic component (E) comprises a heat absorbing chamber (2) bonded to a surface of the electronic component (E) in which electric heating occurs, a refrigerant (3) inserted into the heat absorbing chamber (2) and composed of a fluorinated ketone solution having a low boiling point, a heat exchanger (4) fixed at a higher position than that of the heat absorbing chamber (2) so that the refrigerant (3) evaporated in the heat absorbing chamber (2) is transported by rising convection, a heat dissipating fan (5) fixed to one side of the heat exchanger (4), an evaporation circulation hose (6) of which both ends are connected to an evaporation outlet (2a) of the heat absorbing chamber (2) and an inlet (4a) of the heat exchanger (4), and a liquefaction circulation hose (7) of which both ends are connected to an outlet (4b) of the heat exchanger (4) and a liquefaction inlet (2b) of the heat absorbing chamber (2). According to the present invention, a heat resistant fiber body (8) is coupled with the evaporation circulation hose (6) and liquefaction circulation hose (7) made of silicone so as to improve the durability, and the heat absorbing chamber (2) includes a heat absorbing plate (21) made of a metal having high heat conductivity and a heat absorbing cover (23) made of silicon having high insulation performance so as to provide high cooling efficiency. Furthermore, the heat absorbing chamber (2) and the heat exchanger (4) are circulated only by the convection phenomenon of the refrigerant (3) so that the cooling efficiency is remarkably improved without using a pump. Moreover, a short circuit does not occur even if the refrigerant (3) leaks. Therefore, the failure or the risk of catching fire of an electronic product may be prevented, thereby maximizing safety. |
