| 摘要 |
Disclosed is a foldable carrier tape for a semiconductor package to reduce the size of a packing material. To achieve this, the present invention provides a foldable carrier tape for a semiconductor package, comprising a carrier tape main body; gearwheel holes arranged at the top of the carrier tape main body in a horizontal direction; pockets which are arranged below the gearwheel holes and which are intagliated to allow a semiconductor package to be inserted into it; folding holes which are vertical to the gearwheel holes and which are arranged above the carrier tape main body; and slits which are arranged in the same direction as the folding holes. Therefore, the present invention can increase the height of the packing material as the packing material is shaped into a rectangular box, although a conventional packing material has a cylindrical shape. |
