PRINTED CIRCUIT BOARD FOR MOUNTING CHIP AND MANUFACTURING METHOD THEREOF

摘要

The present invention provides a manufacturing method for a chip mounting type printed circuit board including a step of forming a plurality of circuit pattern layers connected to a via hole on one side of a core layer or the other side facing the one side; a step of mounting a chip by preparing a chip mounting cavity penetrating the core layer; a step of filling the chip mounting cavity and an inner area of the via hole by laminating a first insulation material layer on one side of the core layer; and a step of laminating a different kind of a second insulation material layer from the first insulation material layer on the surface of the core layer.