| 摘要 |
Disclosed is a heat pump device capable of increasing water temperature above 50°C without a separate heating source at the process of heating water. The heat pump device comprises: a first condenser, which condenses a first refrigerant; a first heat exchanger, which heat-exchanges the first refrigerant with outside air; an outdoor unit, which is equipped with a first expansion valve for expanding the first refrigerant; a second heat exchanger, which heat-exchanges the first refrigerant with indoor air; an indoor unit, which is equipped with a second expansion valve for expanding the first refrigerant; a second condenser, which condenses a second refrigerant; a third heat exchanger, which heat-exchanges the first refrigerant with the second refrigerant; a fourth heat exchanger, which heat-exchanges the first refrigerant with water; a fifth heat exchanger, which heat-exchanges the second refrigerant with water; a third expansion valve and a fourth expansion valve, which expand the first refrigerant; a hydro unit, which is equipped with a fifth expansion valve for expanding the second refrigerant; a refrigerant flow path switching unit, which switches the flow path of the first refrigerant between the first condenser and the first heat exchanger, between the first condenser and the second heat exchanger, between the first condenser and the third heat exchanger, and between the first condenser and the fourth heat exchanger; and a water flow path switching unit, which switches water flow path so that water flows into either the fourth heat exchanger or the fifth heat exchanger. |
