| 摘要 |
The present invention relates to a circular wire using a superconducting thin film wire and a continuous fabrication method thereof. The method of continuously fabricating the circular wire includes a first step of forming a silver protective layer on surfaces of a plurality of unit superconducting wires having different widths; a second step of forming a laminated superconducting wire by vertically laminating the unit superconducting wires formed thereon with the silver protective layer so that a width of tapes, which are vertically laminated, can be relatively reduced; a third step of thermally pressing the laminated superconducting wire; and a fourth step of immersing the laminated superconducting wire, which has been subject to the thermal pressing, into a plating bath to form a copper plating layer on an outer surface of the laminated superconducting wire. In terms of technology, the present invention is to provide a circular wire using a superconducting thin film wire, in which the circular wire includes a laminated superconducting wire which is formed by vertically laminating a plurality of unit superconducting wires formed thereon with a silver protective layer and having widths different from each other in which the widths of the vertically laminated tapes are relatively reduced and the tapes are bonded with each other through thermal pressing; and a copper plating layer forming on an outer surface of the laminated superconducting wire by immersing the laminated superconducting wire into a plating bath filled with copper solution. The superconducting wire having a plate shape is cut to have a desired width and the wires are vertically laminated at a predetermined step difference and subject to the thermal process, and then the wires are plated with copper so that the circular wires can be continuously fabricated. |
