发明名称 MOVABLE CONTACT ARM FOR MOLDED CASE CIRCUIT BREAKER AND MOVABLE CONTACT ARM ASSEMBLY
摘要 <p>The present disclosure is to provide a movable contact arm capable of securing a revolution radius to a closed position of the movable contact arm such that adhesive materials on the shaft due to arc scattering materials can be removed with no installation of additional elements, and a movable contact arm according to the present disclosure may comprise an adhesive material removal portion formed on a lateral surface at which a contact of the movable contact arm is located, and configured to minimize a contact area with adhesive materials so as to remove the adhesive materials due to an arc.</p>
申请公布号 KR20140002763(U) 申请公布日期 2014.05.09
申请号 KR20120009996U 申请日期 2012.11.01
申请人 发明人
分类号 H01H71/10;H01H73/04 主分类号 H01H71/10
代理机构 代理人
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