UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME

摘要

A unit power module according to the present invention comprises a first semiconductor chip with a 1-1 electrode and a 1-2 electrode spaced apart from the 1-1 electrode on one surface and a 1-3 electrode on the other surface; a second semiconductor chip with a 2-1 electrode on one surface and a 2-2 electrode on the other surface; a first metal plate in contact with the 1-1 electrode of the first semiconductor chip and the 2-1 electrode of the second semiconductor chip; a second metal plate in contact with the 1-2 electrode of the first semiconductor chip and spaced apart from the first metal plate; a third metal plate in contact with the 1-3 electrode of the first semiconductor chip and the 2-2 electrode of the second semiconductor chip; and a sealing member surrounding the first metal plate, the second metal plate, and the third metal plate.