| 摘要 |
<p>A method comprising using a process head 20,25 which has provided one or more cutter units 25, a first and second ink jet head, a drive means for moving the process head; and a control means; whereby the process head produces cuts through three pre-deposited layers of a thin film device 13, the first cut cuts through all three layers 6, the second 7 and third 8 through the top two 7 and the third through the top layer only 8; the process head 20,25 then deposits an insulating material 10 into the first cut 6 via the first ink jet head 14 and deposits a conductive material 12 into the second cut 7 via the second ink jet head 15; where the ink jet heads are provided on a first part of the process head 20, which is provided on the thin film side of the device substrate 1 and at least one of the cutter units is provided on a second part of the process head 25, the second part 25 is provided on the opposite side of the device substrate 1, where the at least one cutter unit comprises a laser directed at the underside of the device 4,5. The thin film device may be a solar panel, a lighting panel or a battery.</p> |
