| 摘要 |
<p>Provided is a chemical machine abrading pad which is used to abrade a substrate made of more than one of the substrates selected from a magnetic substrate, an optical substrate, and a semiconductor substrate, containing multi-functional isocyanate; reaction products of materials including a hardener package containing an amine-initiated polyol hardener and a macromolecular polyol hardner; and an abrading layer having a abrading surface for abrading a substrate, by having a density above 0.6 g/cm^3, ashore hardness of 5-40, a fracture tensile strength of 100-450%, and a cutting speed of 25-150μm/hr. Also provided is a method for manufacturing and using the above chemical machine abrading pad capable of softening and conditioning.</p> |
