ADHESIVE APPARATUS OF PCB USING LD FLEX ADHESIVE INK AND ADHESIVE METHOD

摘要

The present invention relates to an apparatus for bonding a circuit board using thermosetting ink and a method thereof. The apparatus, which bonds a heat sink before bonding a circuit board to a bonding object comprises a support placed on a rear surface of the circuit board; a coating frame connected to an upper portion and a rear portion of the support by a hinge shaft to allow a front portion to move up and down about the hinge shaft; a mesh installed in the coating frame and having a plurality of perforation portions; a coating roller installed at a front portion of the coating frame on the mesh to perform a reciprocating motion between the front portion and rear portion of the coating frame while being rotated and to coat thermosetting ink on the rear surface of the circuit board through the perforation portions of the mesh; and a control unit installed on the support and enabling the up and down motion of the coating frame and the rotation and the reciprocating movement of the coating roller to be automatically performed. Thus, the heat sink adheres to the rear surface of the LED circuit board by coating the thermosetting ink. The number of heat sink attaching processes is reduced so that working time is reduced. In addition, the processes are automatically performed so there is no need to manually perform the processes.