发明名称 MULTI-LAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD EMBEDDING THE SAME
摘要 <p>The present invention relates to a laminated ceramic capacitor and a printed circuit board having the same, capable of minimizing deviation in thickness of electrodes and laminated ceramic. A laminated ceramic capacitor according to an embodiment of the present invention includes laminated ceramic and outer electrodes formed on both sides of the laminated ceramic, wherein (Tmax - Tmin) is 10μm or less and (CTmax - CTmin) is 20μm or less (wherein Tmax is the maximum thickness of the outer electrode in a via processing region, Tmin is the minimum thickness of the outer electrode in the via processing region, CTmax is the maximum thickness of the laminated ceramic capacitor in the via processing region, and CTmin is the minimum thickness of the laminated ceramic capacitor in the via processing region).</p>
申请公布号 KR20140055400(A) 申请公布日期 2014.05.09
申请号 KR20120122149 申请日期 2012.10.31
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SEUNG EUN;LEE, BYOUNG HWA;SHIN, YEE NA;CHUNG, YUL KYO
分类号 H01G4/12;H05K1/18 主分类号 H01G4/12
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