发明名称 CALIBRATION METHOD OF ELECTRONIC DEVICE MOUNTING APPARATUS
摘要 Disclosed is a calibration method for an electronic device mounting apparatus. The calibration method for an electronic device mounting apparatus according to the embodiment of the present invention includes the following steps of: calibration jigs picked up by the use of a bonding picker; the center of the mobile camera is moved to the set reference position of the calibration table, and the offset is rectified to correspond the center of the mobile camera with the center of the calibration table based on the fixed results; the bonding picker which picked up the calibration jigs is moved to the set center location of the mobile camera, the turn angles of the calibration jigs are differentiated, and the calibration jigs are filmed numerous times to calculate the location information and detect the center of the location of the bonding picker based on the location information; the offset of the bonding picker′s center of location is rectified toward the center of the fixed camera; offset of the calibration jigs is rectified toward the center of the fixed camera after detecting the positional value of the calibration jigs by filming the calibration jigs picked up by the bonding picker using a fixed camera.
申请公布号 KR20140054728(A) 申请公布日期 2014.05.09
申请号 KR20120120573 申请日期 2012.10.29
申请人 HANMISEMICONDUCTOR CO., LTD. 发明人 JUNG, HYUN GYUN;LEE, KYUNG SHIK;LEE, JOO SEONG
分类号 H01L21/52;H01L21/68 主分类号 H01L21/52
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