| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a laminate which causes less disconnection due to flaws of a substrate even in forming a wiring circuit by a subtractive method without using a high-cost protective film or a high-cost wet hard coat layer.SOLUTION: A method of producing a laminate is used to produce a laminate having a substrate 1, a metal layer A and a metal layer B in this order, with the combination of the metal layer A and the metal B described hereafter as a metal layer C. With the thickness of the metal layer C as 100%, a metal layer A of a thickness of 30 nm or greater and 0.1-20% of the thickness of the metal layer C is formed by a sputtering method (hereinafter called as step A), and then a metal layer B of a thickness of 240 nm or greater and 80-99.9% of the thickness of the metal layer C is formed by an evaporation method (hereinafter called as step B). The metal layer C has a thickness of 0.3-10μm, and the metal layer A has a surface resistivity of 0.01-10Ω/sq. |
