发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 Each stitch part of a plurality of leads of a package has a first region having the most outer surface on which Ag plating is applied and a second region having the most outer surface on which Ni plating is applied. Further, the second region is arranged on a die pad side, and the first region is arranged on a periphery side of a sealer. Therefore, in each stitch part, types of plating applied on the most outer surfaces of the first region and the second region can be differentiated from each other, a thick Al wire can be connected to the second region of the second lead, and a thin Au wire can be connected to the first region of the first lead. As a result, usage of only Au plating can be avoided, so that the cost of the package is reduced.
申请公布号 US2014124912(A1) 申请公布日期 2014.05.08
申请号 US201314065242 申请日期 2013.10.28
申请人 RENESAS ELECTRONICS CORPORATION 发明人 KANEDA YOSHIHARU
分类号 H01L23/00;H01L23/495 主分类号 H01L23/00
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