DIE STRUCTURE, TRANSFER MOLDING DEVICE, AND TRANSFER MOLDING METHOD

摘要

A die structure equipped with: a first die (9); a second die (10) capable of contacting and separating from the first die (9); heating means (15, 22) provided on at least one of the dies; transfer members (14, 20), which are provided on at least one of the dies, are capable of separating and moving relative to the dies, and perform transfer molding by bringing a transfer surface into contact with a resin sheet (25) that is supplied between the dies; and a mechanism for making it possible for the dies and the transfer members (14, 20) to move relative to each other.