发明名称 |
CIRCUIT BOARD AND FABRICATING METHOD THEROF |
摘要 |
The present invention relates to a wiring board which has the overall uniform plating thickness which forms the wiring pattern, and a fabricating method thereof. A wiring board according to an embodiment of the present invention includes an insulating layer; and wiring patterns formed on the insulating layer. At least one among the wiring patterns has a stack structure of at least two plating layers. |
申请公布号 |
KR20140053564(A) |
申请公布日期 |
2014.05.08 |
申请号 |
KR20120119644 |
申请日期 |
2012.10.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, HAN UL;LEE, YONG SAM;AHN, SUK HWAN |
分类号 |
H01L23/12;H01L21/60;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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