| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing tape which can efficiently pick up a thin semiconductor chip in a short time without chip cracks in a pickup process after a dicing process.SOLUTION: A dicing tape 1 of the present embodiment has a peel force with a silicon mirror wafer polished by #2000 at a peeling angle of 90 degrees and a peeling speed of 50 mm/min under conditions of 23°C and 50%RH, the peel force being 0.5 N/25 mm and over before an adhesive layer 1 is radiation hardened and 0.05-0.4 N/25 mm after the adhesive layer 1 is radiation hardened. In addition, when assuming that the peel force with the silicon mirror wafer polished by #2000 at a peeling angle of 90 degrees under conditions of 23°C and 50%RH after the adhesive layer 1 is radiation hardened at a peeling speed of 50 mm/min is (i) and at a peeling speed of 1000 mm/min is (ii), (ii)/(i) is not greater than 1. |
