ELECTRONIC PACAKGE MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.