| 摘要 |
The solar cell of the present invention includes a semiconductor substrate, a back-side electrode arranged in a region excluding at least a predetermined conductor arrangement region in the back surface of the semiconductor substrate, and solder adhering to the back surface of the semiconductor substrate in the conductor arrangement region and to the back-side electrode. The method of manufacturing a solar cell of the present invention includes preparing a semiconductor substrate, forming a back-side electrode having an empty portion through which the back surface of the semiconductor substrate is exposed in a region excluding at least a predetermined conductor arrangement region in the back surface of the semiconductor substrate, and soldering in the empty portion by bringing solder into contact with the back surface of the semiconductor substrate exposed in the empty portion and with the back-side electrode and performing ultrasonic soldering. |
