VIBRATION TYPE PLATING APPARATUS

摘要

The present invention relates to a vibration type plating apparatus comprising: a plating unit having a container which is installed in the atmosphere to receive a semiconductor chip and a plating solution together; and a vibration unit installed under the plating unit to vibrate the entire plating unit vertically and horizontally. The vibration type plating apparatus of the present invention, which comprises the plating unit having the container which is installed in the atmosphere to receive the semiconductor chip and the plating solution together and the vibration unit installed under the plating unit to vibrate the entire plating unit vertically and horizontally, can be safe by sealing the container with a lid to prevent the dispersion of the plating solution, can be economical and contribute to environmental protection by performing plating using a small amount of the plating solution, can amplify vibration in the plating unit by supporting between the plating unit and the vibration unit using a plurality of elastic members, thus improving the circulation of the plating solution to improve plating efficiency, can improve plating quality by efficiently overcoming the sticking of chips, can be advantageous to variation management by managing a plating thickness thin and uniformly, and can improve productivity by reducing plating time.