RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN FILM FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board capable of providing a printed wiring board with good dielectric characteristics in a high frequency region while sufficiently maintaining compatibility of a resin component and to provide a method for producing the same.SOLUTION: There is provided a resin composition for a printed wiring board which comprises: (A) a saturated thermoplastic elastomer having a styrene unit; (B) at least one component selected from the group consisting of an epoxy resin, a cyanate ester resin and a maleimide compound; and (C) a spherical silica which is surface-treated with an amino-based silane coupling agent, wherein the mass ratio W/Wof the (A) component to the (B) component is 0.43 to 5.0.