| 摘要 |
The present invention relates to a member for a semiconductor manufacturing device. The purpose of the present invention is to provide the member which does not generate cracks and arcking easily since a gas dispersion plate and a shaft are not corroded. A high frequency power supplying device (10) bonds a shaft (16) having a penetration hole (20) in which gas passes to one side of a plate (12) of the gas dispersion plate in which a high frequency electrode (14) is buried. The plate (12) and the shaft (16) are formed of ceramics. The shaft (16) is formed into a double pipe structure having an internal pipe (18) and an external pipe (22). The internal space of the internal pipe (18) is formed into the penetration hole (20). The plate (12), the internal pipe (18), and the external pipe (22) are bonded with a solid-phase to maintain a sealing state. A bonding position of the shaft (16) is the center of the plate (12). |
