| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an art capable of improving product yield of a semiconductor device.SOLUTION: A semiconductor device manufactured by using: a plurality of die pads DP arranged between an outer frame F1a or an outer frame F1b, which extends in a first direction and an inner frame F2 extending in the first direction at a distance from the outer frame F1a, the outer frame F1b and the inner frame F2 and at regular intervals along the first direction; a plurality of leads LE1 connected to the inner frame F2 and the plurality of die pads DP; a plurality of hanging leads HL connected to the outer frame F1a and the plurality of die pads DP or the outer frame F1b and the plurality of die pads DP; and a lead frame LF1 which is connected to the outer frame F1a or the outer frame F1b and includes a plurality of post leads LE2 lying at a distance from the plurality of die pads DP.</p> |
