发明名称 TRANSFER MOLDING METHOD AND TRANSFER MOLDING APPARATUS
摘要 A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
申请公布号 US2014124965(A1) 申请公布日期 2014.05.08
申请号 US201313762766 申请日期 2013.02.08
申请人 OMRON CORPORATION 发明人 TAKEMURA KOICHI;SHIBATA TOMOFUSA;YAMANAKA YOSHIHISA;SUZUKI KENJI;KANEKO KAZUTAKA;TAGUCHI YOSHIKAGA;KOJIMA MASAYUKI
分类号 B29D11/00;B29C59/02 主分类号 B29D11/00
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