发明名称 LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser processing method for performing stable laser processing even to a work piece having warpage.SOLUTION: There is provided a laser processing method for performing laser processing on a work piece having warpage in which an irradiation scheduled line of a laser beam is set, the method comprising: a holding step of holding the work piece by holding means; a laser processing step of performing the laser processing on the work piece along the laser beam irradiation scheduled line by irradiating the work piece held by the holding means with the laser beam by laser beam irradiation means and relatively moving the holding means and the laser beam irradiation means. In the laser processing step, irradiation with the laser beam is executed while a pressing member arranged on both sides of the laser beam irradiation scheduled line of the work piece presses the work piece under processing.
申请公布号 JP2014079791(A) 申请公布日期 2014.05.08
申请号 JP20120230049 申请日期 2012.10.17
申请人 DISCO ABRASIVE SYST LTD 发明人 MANTANI KAZUYA
分类号 B23K26/10;B23K26/00;H01L21/301 主分类号 B23K26/10
代理机构 代理人
主权项
地址