发明名称 METHOD FOR DEPOSITING SILICON NITRIDE FILM AND DEPOSITION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for depositing a silicon nitride film capable of forming even a silicon nitride film containing much silicon with respect to SiNwithout spoiling workpiece in-plane uniformity of a film thickness.SOLUTION: A method for depositing a silicon nitride film comprises the steps of: (1) supplying a silicon material gas into a processing chamber; and (2) supplying a nitriding agent gas into the processing chamber. The step (1) further includes an initial stage of supplying the silicon material gas and a later stage of supplying the silicon material gas following the initial stage. In the initial stage of supplying the silicon material gas, a first pressure is the pressure in the processing chamber. In the later stage of supplying the silicon material gas, a second pressure lower than the first pressure is the pressure in the processing chamber.
申请公布号 JP2014082322(A) 申请公布日期 2014.05.08
申请号 JP20120229186 申请日期 2012.10.16
申请人 TOKYO ELECTRON LTD 发明人 TONEGAWA YAMATO ; TABUKI KEIJI
分类号 H01L21/318;C23C16/42;C23C16/455;H01L21/31 主分类号 H01L21/318
代理机构 代理人
主权项
地址