发明名称 |
METHOD FOR DEPOSITING SILICON NITRIDE FILM AND DEPOSITION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing a silicon nitride film capable of forming even a silicon nitride film containing much silicon with respect to SiNwithout spoiling workpiece in-plane uniformity of a film thickness.SOLUTION: A method for depositing a silicon nitride film comprises the steps of: (1) supplying a silicon material gas into a processing chamber; and (2) supplying a nitriding agent gas into the processing chamber. The step (1) further includes an initial stage of supplying the silicon material gas and a later stage of supplying the silicon material gas following the initial stage. In the initial stage of supplying the silicon material gas, a first pressure is the pressure in the processing chamber. In the later stage of supplying the silicon material gas, a second pressure lower than the first pressure is the pressure in the processing chamber. |
申请公布号 |
JP2014082322(A) |
申请公布日期 |
2014.05.08 |
申请号 |
JP20120229186 |
申请日期 |
2012.10.16 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
TONEGAWA YAMATO ; TABUKI KEIJI |
分类号 |
H01L21/318;C23C16/42;C23C16/455;H01L21/31 |
主分类号 |
H01L21/318 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|