| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip which can inhibit deterioration in connection reliability.SOLUTION: A semiconductor chip 1 comprises: a plurality ot input bump electrodes 3; a plurality of output bump electrodes 4; and dummy bump electrodes 5. When assuming that a gross area of the plurality of input bump electrodes 3 is S1, a gross area of the plurality of output bump electrodes 4 is S2 and a gross area of the dummy bump electrodes 5 is S3, S2>S1 and S1≥(S2+S3)×0.71 are satisfied. At the same time, when a length from a point nearest to a long side 2b of the plurality of output bump electrodes 4 to a point farthest in a Y direction is A, a pitch in an X direction in one row of the output bump electrodes 4 is P, a length of the dummy bump electrode 5 in the Y direction is B and a length of the dummy bump electrode 5 in the X direction is C, A×P×1.25<B×C is satisfied. |
