Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.
申请公布号
WO2014069734(A1)
申请公布日期
2014.05.08
申请号
WO2013KR04112
申请日期
2013.05.09
申请人
LG INNOTEK CO., LTD.
发明人
JUNG, WON SUK;LEE, KYU WON;AN, YUN HO;LEE, WOO YOUNG
