| 摘要 |
<p>In order to individually inspect each of the electronic components, and to further reduce a wiring space, a substrate (1) with a built-in component includes: a first resin layer (2c), which has formed therein a space for housing an electronic component (3), and which has at least one first interlayer connecting body (6a) on the outer side of each of at least the three sides of a main surface of the electronic component (3); and a second resin layer (2d) having at least one second interlayer connecting body (6b) on the outer side of each of at least the three sides of the main surface, and a plurality of third interlayer connecting bodies (6c) that are directly bonded to a plurality of terminal electrodes. The first resin layer (2c) and the second resin layer (2d) are adjacent to each other in the laminating direction in a multilayer substrate (2), and the first interlayer connecting body (6a) and the second interlayer connecting body (6b) are directly bonded to each other.</p> |
