| 摘要 |
<p>Disclosed is a plasma treatment device in which power loss in the power supply line and the matching unit can be reduced. The plasma treatment device (100) is provided with: a plurality of plasma processors (3); a matching unit (4) for performing impedance matching between the plasma load of the plurality of plasma processors (3) and a high-frequency power source unit (2); and a power supply unit (5) for supplying, to the plurality of plasma processors (3), high-frequency power impedance-matched by the matching unit (4). The power supply unit (5) has an inductive coupler (6) for supplying high-frequency power using inductive coupling to each of the plurality of plasma processors (3). The inductive coupler (6) has a linear primary-side power supply rod (7) to which high-frequency power is supplied through the output of the matching unit (4) from the high-frequency power source unit (2), and a plurality of secondary-side coils (8) for generating an induced electromotive force by a high-frequency variable magnetic flux generated around the primary-side power supply rod (7) and supplying the induced current generated by the induced electromotive force to each of the plurality of plasma processors (3).</p> |
