发明名称 SUBSTRATE MEMBER AND METHOD FOR MANUFACTURING CHIP
摘要 <p>PROBLEM TO BE SOLVED: To improve the number of chips obtained from a substrate member and also improve a yield.SOLUTION: A substrate member W includes a substrate 1, and a plurality of chip regions 2 formed on the substrate via scribe lines 3. The plurality of chip regions each include a first region 2b in contact with the scribe lines and having a plurality of first pattern elements 5b formed therein, and a second region 2a surrounded by the first region and having a plurality of second pattern elements 5a formed therein. There is satisfied at least one of a relationship in which a minimum value of sizes of the first pattern elements is larger than a minimum value of sizes of the second pattern elements and a relationship in which a minimum value of intervals between the adjacent first pattern elements is larger than a minimum value of intervals between the adjacent second pattern elements.</p>
申请公布号 JP2014082468(A) 申请公布日期 2014.05.08
申请号 JP20130185668 申请日期 2013.09.06
申请人 CANON COMPONENTS INC 发明人 KIYOTA HIDEO;INOUE KEISUKE
分类号 H01L27/04;H01L21/301;H01L21/822 主分类号 H01L27/04
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